50-10-0584-0029
manufacturer:
Parker Chomerics
Description:
SILVER EMI EPOXY 1G PACK
Category:
RF and Wireless
In-stock:
In Stock
Payment Method:
L/C, D/A, D/P, T/T, Western Union,
Shipping Method:
LCL, AIR, FCL, Express
Specifications
Category:
RF And Wireless
RFI And EMI - Shielding And Absorbing Materials
Adhesive:
-
Product Status:
Active
Thickness - Overall:
-
Package:
Bulk
Series:
CHO-BOND® 584-29
Material:
Epoxy, 2 Part
Mfr:
Parker Chomerics
Shelf Life Start:
Date Of Manufacture
Width:
-
Shape:
-
Length:
-
Shelf Life:
12 Months
Storage/Refrigeration Temperature:
77°F (25°C)
Operating Temperature:
-
Type:
EMI Conductive Adhesive
Base Product Number:
50-10
Introduction
RF EMI EMI Conductive Adhesive CHO-BOND® 584-29 Epoxy, 2 Part X X
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| Image | Part # | Description | |
|---|---|---|---|
|
|
L-1011-12 |
INSULATED GROUND STRAP .5X12"
|
|
|
|
51-05-4660-0000 |
SILVER COPPER EMI SEALANT 681G
|
|
|
|
19-04-22371-1298 |
CHO-SEAL 1298 AG/AL 0.043" 1'
|
|
|
|
10-04-W204-1298 |
CHO-SEAL 1298 AG/AL 0.125" 1'
|
|
|
|
50-02-1038-1000 |
SILVER CU EMI SEAL 114G
|
|
|
|
CCJ-18-201-0100 |
RF EMI SHIELDING TAPE 54'X1"
|
|
|
|
51-00-1035-0000 |
SILVER GLASS EMI SEALANT W/ PRIM
|
|
|
|
52-00-2003-0000 |
250G KIT CU URETH. W/PRIMER
|
|
|
|
90-01-7002-0000 |
CONDUCTIVE SILICONE SEALANT
|
|
|
|
19-26-1800-0345 |
RF EMI LIQUID FIP MOIST CURE
|
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In Stock
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